International Scientific Publications
© 2007-2026 Science Events Ltd
Terms of Use  ·  Privacy Policy
Language English French Polish Romanian Bulgarian
Conference room
Materials, Methods & Technologies 2026, 28th International Conference
13-16 August, Burgas, Bulgaria
Call for Papers

Materials, Methods & Technologies, Volume 7, 2013

STRUKTURE EVOLUTION OF MULTILAYER MATERIALS OF HEAT-RESISTANT INTERMETALLIC COMPOUNDS UNDER THE INFLUENCE OF TEMPERATURE IN THE PROCESS OF DIFFUSION WELDING UNDER PRESSURE AND THEIR MECHANICAL PROPERTIES
Valeriy P. Korzhov, Michael I. Karpov, Dmitriy V. Prokhorov
Pages: 343-361
Published: 1 Jan 2013
Views: 56
Abstract: Multilayer materials of high-resistant intermetallic compounds of some transition metals with aluminum and silicon were obtained by diffusion welding of packages, collected from a large number of the respective foils, such as niobium and aluminum. Materials of intermetallics with silicon were obtained by the welding of packages built from metal foils with Si-coating. The change in the structure according to the temperature of the welding was studied, and the high-temperature bending strength was determined.
Keywords: multilayer composite, high-resistant material, intermetallic compound, diffusion welding
Cite this article: Valeriy P. Korzhov, Michael I. Karpov, Dmitriy V. Prokhorov. STRUKTURE EVOLUTION OF MULTILAYER MATERIALS OF HEAT-RESISTANT INTERMETALLIC COMPOUNDS UNDER THE INFLUENCE OF TEMPERATURE IN THE PROCESS OF DIFFUSION WELDING UNDER PRESSURE AND THEIR MECHANICAL PROPERTIES. Journal of International Scientific Publications: Materials, Methods & Technologies 7, 343-361 (2013). https://www.scientific-publications.net/en/article/1003066/
Back to the contents of the volume

Submit Feedback

We value your input! Use this form to report any concerns or provide feedback on our published articles. All submissions will be kept confidential.

By using this site you agree to our Privacy Policy and Terms of Use. We use cookies, including for analytics, personalisation, and ads.