CHARACTERIZATION OF SAMARIUM COPPER TANTALATE - A NEW PEROVSKITE MATERIAL WITH HIGH DIELECTRIC PERMITTIVITY
Dorota Szwagierczak, Jan Kulawik
Pages: 332-338
Published: 1 Jan 2012
Views: 375
Downloads: 31
Abstract: A permanent progress in miniaturization of electronic capacitive elements requires development of new materials exhibiting a high dielectric constant. The paper reports on synthesis and sintering conditions and dielectric properties of a new ceramic material with the composition Sm2/3CuTa4O 12. This material has a complex perovskite structure analogous to that of Cu2Ta4O 12. Its high dielectric 5 permittivity reaching 10 could be attributed to spontaneous formation of internal barrier layer capacitors (IBLC). Complex impedance spectroscopic studies carried out at frequencies of 10 Hz – 2 MHz and in a wide temperature range from -55 to 700°C reveal two types of dielectric response of the ceramic samples. A high-frequency and low-temperature response is related to grains, whereas a low-frequency and high-temperature response is attributed to grain boundaries. Scanning electron microscope images and energy-dispersive X-ray microanalysis confirmed the existence of semiconducting grains and more resistive grain boundaries in the investigated ceramic material.
Keywords: samarium copper tantalate, perovskite ceramic, dielectric properties, internal barrier layer capacitor
Cite this article: Dorota Szwagierczak, Jan Kulawik. CHARACTERIZATION OF SAMARIUM COPPER TANTALATE - A NEW PEROVSKITE MATERIAL WITH HIGH DIELECTRIC PERMITTIVITY. Journal of International Scientific Publications: Materials, Methods & Technologies 6, 332-338 (2012). https://www.scientific-publications.net/en/article/1003182/
Back to the contents of the volume
© 2026 The Author(s). This is an open access article distributed under the terms of the
Creative Commons Attribution License https://creativecommons.org/licenses/by/4.0/, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. This permission does not cover any third party copyrighted material which may appear in the work requested.
Disclaimer: The Publisher and/or the editor(s) are not responsible for the statements, opinions, and data contained in any published works. These are solely the views of the individual author(s) and contributor(s). The Publisher and/or the editor(s) disclaim any liability for injury to individuals or property arising from the ideas, methods, instructions, or products mentioned in the content.
