MONITORING OF MICROBIAL ADHESION AND BIOFILM GROWTH USING ELECTROCHEMICAL IMPEDANCEMETRY
Martin Martinov, Andre Darchen, Dimitre Hadjiev
Pages: 334-346
Published: 1 Jan 2011
Views: 129
Abstract: The possibility to use electrochemical impedance spectroscopy to monitor the cell attachment and the biofilm proliferation was tested. In order to identify characteristic events induced on the metal surface Gram-negative (Pseudomonas aeruginosa PAO1) and Gram-positive (Bacillus subtillis) bacteria strains have been studied. Electrochemical impedance spectra of AISI 304 electrodes during cell attachment and initial biofilm growth for both strains were obtained. It can be observed that the resistance increases gradually with the culture time and decreases with the biofilm detachment. So, the applicability of electric cell-substrate impedance sensing (ECIS) for studying the attachment and spreading of cells on a metal surface has been demonstrated. The biofilm formation was also characterized by the use of SEM and confocal laser scanning microscopy and COMSTAT image analysis. The electrochemical results roughly agree with the microscope image observations. The obtained results have been compared to existing data and the possibility to use the method for biofilm characterization was discussed. The ECIS technique used in this study was used for continuous real- time monitoring of the initial bacterial adhesion and the biofilm growth. It provides a simple and non expensive electrochemical method for in vitro assessment of the presence of biofilms on metal surfaces.
Keywords: electrochemical impedance, microbial adhesion, biofilm thickness
Cite this article: Martin Martinov, Andre Darchen, Dimitre Hadjiev. MONITORING OF MICROBIAL ADHESION AND BIOFILM GROWTH USING ELECTROCHEMICAL IMPEDANCEMETRY. Journal of International Scientific Publications: Materials, Methods & Technologies 5, 334-346 (2011). https://www.scientific-publications.net/en/article/1003311/
Back to the contents of the volume
© 2026 The Author(s). This is an open access article distributed under the terms of the
Creative Commons Attribution License https://creativecommons.org/licenses/by/4.0/, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. This permission does not cover any third party copyrighted material which may appear in the work requested.
Disclaimer: The Publisher and/or the editor(s) are not responsible for the statements, opinions, and data contained in any published works. These are solely the views of the individual author(s) and contributor(s). The Publisher and/or the editor(s) disclaim any liability for injury to individuals or property arising from the ideas, methods, instructions, or products mentioned in the content.
